Semiconductor & Embedded Engineering
Semiconductor programmes run to a schedule set by the fab, not by the calendar. A new facility moves from cleanroom construction and base build through tool install and hook up, ultrapure water and bulk gas distribution, and commissioning, before a single wafer runs. Each phase draws a different mix of disciplines and each has a handover the next phase cannot start without.
Once the fab is producing, the work changes character rather than stopping. Process engineering runs across lithography, etch, diffusion, thin film and CMP. Equipment engineering keeps tools inside their qualification windows. Test and ATE development, yield analysis and failure analysis close the loop between what the line produces and what the process was designed to deliver.
Product and package engineering, VLSI design and embedded software sit alongside the fab, where silicon becomes a part somebody else builds into a system. The constant across all of it is that a delay in one discipline stops every discipline behind it, and the qualified people who can close that gap are not available at short notice in most labour markets.
What TSD delivers
- Cleanroom construction, base build and facility fit out support
- Tool install, hook up and qualification through to production release
- Ultrapure water, bulk gas and chemical distribution systems
- Process engineering across lithography, etch, diffusion, thin film and CMP
- Equipment engineering and preventive maintenance inside qualification windows
- Test and ATE programme development, characterisation and debug
- Yield analysis, failure analysis and process control feedback
- Product and package engineering, VLSI design and embedded software
Roles placed
- Process Engineer
- Equipment Engineer
- Test and ATE Engineer
- Yield and Failure Analysis Engineer
- Product and Package Engineer
- VLSI Design Engineer
- Embedded Software Engineer